MIL-M-38510/291B
1.2.4 RHA level. Radiation hardness levels will be as defined in MIL-PRF-38535.
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1.3 Absolute maximum ratings (device types 01 through 10).
Supply voltage range (VCC-VSS)....................................... -0.3 V dc to +7.0 V dc
Input voltage range.......................................................... (VSS -0.3 V) s VI s (VCC +0.3V)
Storage temperature range ............................................ -65°C to +150°C
Maximum dc output current............................................. 50 mA Maximum power dissipation (PD) ................................. 1 W Lead temperature (soldering, 5 seconds) ....................... +270°C Junction temperature (TJ) 1/.......................................... +150°C
Thermal resistance, junction-to-case ( θ JC) :
Case J, R, X, Y, and Z (See MIL-STD-1835)
1.4 Recommended operating conditions.
Supply voltages:
VCCDR (data retention supply voltage):
Device types 01 through 06 and device types
09 and 10 ................................................................... 2.0 V dc
Device types 07 and 08............................................... 3.0 V dc
VCC ................................................................................ 4.5 V dc minimum to 5.5 V dc maximum
VSS................................................................................. 0 V dc
High level input voltage (VIH) (all inputs):
Device types 01, 03 through 06 and device
Types 09 and 10......................................................... VCC -2.3 V to VCC +0.3 V Device type 02............................................................... VCC -2.1 V to VCC +0.3 V Device type 07............................................................... VCC -1.5 V to VCC +0.3 V Device type 08............................................................... 2.3 V to VCC +0.3 V
Low level input voltage (VIL) (all inputs):
All device types ............................................................. VSS -0.3 V to +0.8 V
Case operating temperature range (TC ) ......................... -55°C to +125°C
2.0 APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and standards. The following specifications and standards form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/ Maximum junction temperature will not be exceeded except for allowable short duration burn in screening conditions in accordance with method 5004 of MIL-STD-883.
2
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