MILITARY SPECIFICATION
INCH-POUND MIL-M-38510/210F
19 June 2013
SUPERSEDING MIL-M-38510/210E
27 March 2006
MICROCIRCUIT, DIGITAL, 16,384 BIT SCHOTTKY, BIPOLAR, PROGRAMMABLE READ-ONLY MEMORY (PROM), MONOLITHIC SILICON
Inactive for new design after 24 July 1995
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, programmable read-only memory (PROM) microcircuits which employ thin film nichrome (NiCr) resistors, platinum-silicide, tungsten (W), titanium-tungsten (TiW) or zapped vertical emitter as the fusible link or programming element. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4).
1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.
1.2.1 Device types. The device types are as follows:
Device type |
Circuit |
Access times (ns) |
01 |
2048 words/8 bits per word PROM with uncommitted |
100, 50 |
collector |
||
02 |
2048 words/8 bits per word PROM with active pull-up |
100, 50 |
and a third high-impedance state output |
||
03 |
2048 words/8 bits per word PROM with uncommitted |
55, 30 |
collector |
||
04 |
2048 words/8 bits per word PROM with active pull-up |
55, 30 |
And a third high-impedance state output |
||
05 |
4096 words/4 bits per word PROM with active pull-up |
80, 40 |
and a third high-impedance state output |
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter J |
Descriptive designator GDIP1-T24 or CDIP2-T24 |
Terminals 24 |
Package style Dual-in-line |
K |
GDFP2-F24 or CDFP3-F24 |
24 |
Flat pack |
R |
GDIP1-T20 or CDIP2-T20 |
20 |
Dual-in-line |
L |
GDIP3-T24 or CDIP4-T24 |
24 |
Dual-in-line |
3 |
CQCC1-N28 |
28 |
Square leadless chip carrier |
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DLA Land and Maritime-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to memory@dla.mil . Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.dla.mil
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