MIL-M-38510/103H
NOTES:
1. Test circuit pin conditions and test temperatures shall be as specified in table III.
2. Precautions shall be taken to prevent damage to the device under test (OUT) during insertion into socket
and change of relay switch positions (for example, disable voltage-current supplies, current limit ±VCC, etc.).
3. As required to prevent oscillations. Also, proper wiring procedures shall be followed to prevent oscillations.
Loop response and settling time shall be consistent with test rate such that any value has settled to within
5 percent of its final value before value is measured. Suggested values shown may not ensure loop stability for all layouts. Actual compensation used shall be approved by the preparing activity prior to use.
4. Any oscillation greater than 300 mV(p-p) shall be cause for device failure.
5. For dual devices, both halves shall be tested. The output of the idle half shall be driven to the off state by using either a differential input voltage or a strobe input, or the idle half may be biased the same as the
tested half if oscillations can be avoided.
6. These resistors are ±0.1 percent tolerance matched to ±0.01 percent. All other resistors are ±1 percent tolerance and capacitors are 10 percent tolerance.
7. All relays are shown in the normal deenergized state.
FIGURE 2. Test circuit for static and dynamic tests - continued.
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