MIL-M-38510-209 Microcircuit, Digital, 8192-Bit, Schottky, Bipolar, Programmable Read-Only Memory Prom, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, PROM microcircuits which employ thin film nichrome NiCr resistors, zapped vertical emitter, tungsten W, titanium tungsten TiW, or platinum silicide as the fusible link or programming element. Two product assurance class and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.4.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46 - 47 - 48 - 49 - 50 - 51 - 52 - 53 - 54 - 55 - 56 - 57 - 58 - 59 - 60 - 61 - 62 - 63 - 64 - 65 - 66 - 67

MIL-M-38510/209H

NOTES:

1.    Index area; a tab (dim K) may be used to identify pin one. This tab may be located on either side as shown.

2.    Dimension Q shall be measured at the point of exit of the lead from the body.

3.    This dimension allows for off-center lid, meniscus and glass overrun.

4.        The basic pin spacing is .050 (1.27 mm) between centerlines.  Each pin centerline shall be located within ±.005 (0.13 mm) of its exact longitudinal position relative to pins relative to pins 1 and 18.

5.    All leads - increase limit by .003 (0.08 mm) measured at the center of the flat, when lead finish A is applied.

6.    Sixteen spaces.

7.    Applies to all four corners (leads number 2, 8, 11, and 17).

8.    Dimension S1 may be .000 (0.00 mm) if leads are brazed to the metallized ceramic body (see MIL-STD-1835).

9.    Optional, see note 1.  If a pin one identification mark is used in addition to this tab, the minimum limit of

dimension K does not apply.

10.   Applies to leads number 1, 9, 10, and 18.

FIGURE 1. Case outline X - Continued.

8