MIL-M-38510-555 Microcircuits, Digital, Cmos, Remote Terminal Interface, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, CMOS, remote terminal interface RTI microcircuits. One product assurance class class B and a choice of case outlines, and lead finishes are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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MIL-M-38510/555B

4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:

a. Tests shall be performed in accordance with table II herein.

b. Subgroups 5 and 6 of table I of method 5005 of MIL-STD-883 shall be omitted.

c. Subgroup 4 (CI and CO measurements) shall be measured only for initial qualification and after process or design changes that may affect input/output capacitance. Capacitance shall be measured between the designated terminal and VSS at a frequency of 1 MHz. One pin of each input and output buffer (driver) type shall be tested on each device. The pin selected for a given buffer type shall be rotated for each subsequent device tested.

d. Instruction mnemonics for the functional tests of subgroups 7 and 8 and switching tests of subgroups 9,

10, and 11 shall be as specified in table III.

e. Test vectors for subgroups 7 through 11 shall be as defined in table III.

f. The output/load circuit for subgroups 7 through 11 shall be as shown on figure 4.

4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.

4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:

a. End-point electrical parameters shall be as specified in table II herein.

b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883.

4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical tests shall be as specified in table II herein.

4.4.5 Constant acceleration. The constant acceleration tests of groups C and D shall be performed using test condition D.

4.5 Methods of inspection. Methods of inspection shall be specified as follows:

4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents given are conventional and positive when flowing into the referenced terminal.

4.5.2 Quiescent supply current IDD test. When performing quiescent supply current measurements, IDD, the meter shall be placed so that all currents flow through the meter.