MIL-M-38510-51 Microcircuits, Digital, Cmos, Flip-Flops And Latchets, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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INCH-POUND MIL-M-38510/51F

8 October 2004

MILITARY SPECIFICATION

MICROCIRCUITS, DIGITAL, CMOS, FLIP-FLOPS AND LATCHES, MONOLITHIC SILICON

SUPERSEDING MIL-M-38510/51E

30 April 1984

Reactivated after 8 Oct. 2004 and may be used for new and existing designs and acquisitions.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits.

Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA)

are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of

MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).

1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.

1.2.1 Device types. The device types are as follows: Device type Circuit

01 Dual D-type edge triggered flip-flop

02 Dual J-K master slave flip-flop

03 Quad three-state R/S latch

51 Dual D-type edge triggered flip-flop

52 Dual J-K master slave flip-flop

53 Quad three-state R/S latch

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style

A	GDFP5-F14 or CDFP6-F14	14	Flat pack
C	GDIP1-T14 or CDIP2-T14	14	Dual-in-line
D	GDFP1-F14 or CDFP2-F14	14	Flat pack
E	GDIP1-T16 or CDIP2-T16	16	Dual-in-line
F	GDFP2-F16 or CDFP3-F16	16	Flat pack
N	CDFP4-T16	16	Flat pack
T	CDFP3-F14	14	Flat pack
X 1/ 2/	GDFP5-F14 or CDFP6-F14	14	Flat pack, except A dimension
Y 1/ 2/	GDFP1-F14 or CDFP2-F14	14	equals 0.1" (2.54 mm) max Flat pack, except A dimension
			equals 0.1" (2.54 mm) max
Z 1/ 2/	GDFP2-F16 or CDFP3-F16	16	Flat pack, except A dimension equals 0.1" (2.54 mm) max

1/ As an exception to MIL-PRF-38535, appendix A, for case outlines X, Y, and Z only, the leads of bottom brazed ceramic packages (i.e., configuration 2 of case outlines A, D, or F) may have electroless nickel undercoating which is 50 to 200 microinches (1.27 to 5.08 µm) thick provided the lead finish is hot solder dip (i.e., finish letter A) and provided that, after any lead forming, an additional hot solder dip coating is applied which extends from the outer tip of the lead to no more than

0.015 inch (0.38 mm) from the package edge.

2/ For bottom or side brazed packages, case outlines X, Y, and Z only, the S1 dimension may go to .000 inch

(.00 mm) minimum.

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or email CMOS@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at www.dodssp.daps.mil.

AMSC N/A FSC 5962