MIL-M-38510/2388
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-HD8K-1331, and as follows:
VCC .............................................. Supply voltage
VSS ............................................... Common or reference voltage node
CS ............................................... Chip-selection, input
DIN ............................................... Data input
DOUT............................................. Data output
A0 thru A11.................................... Address input
WE............................................... Read or write input
IOHZ .............................................. High-impedance-state high output current IOLZ............................................... High-impedance-state low output current ICC ................................................ Supply current from VCC supply
tRC ................................................ Read cycle time
tAS ................................................ Address set-up time tWP................................................ Write pulse width
tWR ............................................... Write recovery time
tDW ............................................... Data valid to end of write tDH ................................................ Data hold time
tOH................................................ Output hold time from address change tAA ................................................ Address access time
tACS............................................... Chip selection to output valid tWC ............................................... Write cycle time
tCW ............................................... Chip selection to end of write tAW................................................ Address valid to end of write
tLZ................................................. Chip selection to output in low impedance
tHZ ................................................ Chip deselection to output in high impedance tPU ................................................ Chip selection to power up time
tPD ................................................ Chip deselection to power down time
tWZ................................................ Write enabled to output in high impedance tOW ............................................... Output active from end of write
TLO ............................................... Output leakage current
TC................................................. Case temperature
TA................................................. Ambient temperature
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class 8 (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device Generic-industry
type type
01 2147, 9147-85
02 2114, 91148
03 2147H, 9147-70
04 2114A, 9114D
05 2147H-3, 9147-55
06 2148H, 9148-70
07 2147H-2, 9147-45
6.8 Change from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes.
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