MIL-M-38510/9E
1.3 Absolute maximum ratings.
Supply voltage range (VCC) ....................................................... -0.5 V dc to +7.0 V dc
Input voltage range .................................................................... -1.5 V dc at -12 mA to +5.5 V dc
Storage temperature range ....................................................... -65°C to +150°C Maximum power dissipation per register, PD 1/
Device type 01 .................................................................... 422 mW dc
Device type 02 .................................................................... 400 mW dc
Device type 03 .................................................................... 322 mW dc Device type 04 .................................................................... 372 mW dc Device type 05 .................................................................... 360 mW dc Device type 06 .................................................................... 372 mW dc
Lead temperature (soldering 10 seconds) ................................. 300°C
Thermal resistance, junction-to-case (eJC)................................. (See MIL-STD-1835) Junction temperature (TJ ) 2/..................................................... 175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) .................................................................. 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage .............................................. 2.0 V dc
Maximum low level input voltage ............................................... 0.8 V dc
Case operating temperature range (TC ) .................................... -55°C to 125°C Fan out
Device types 01, 02, 04, 05, and 06
High logic level ............................................................ 20
Low logic level ............................................................. 10
Device type 03
High logic level ............................................................ 10
Low logic level ............................................................. 5
Device type 01
Low level setup time at mode control
with respect to clock 1 input ........................................ 35 ns minimum
High level setup time at mode control
with respect to clock 2 input ........................................ 35 ns minimum
Low level setup time at mode control
with respect to clock 2 input ........................................ 10 ns minimum
High level setup time at mode control
with respect to clock 1 input ........................................ 10 ns minimum Width of clock pulse ........................................................... 20 ns minimum Setup time required at serial A, B, C, D inputs ................... 20 ns minimum Hold time required at serial A, B, C, D inputs ..................... 5 ns minimum
Device type 02
Minimum clock pulse width ................................................. 35 ns maximum
Minimum clear pulse width ................................................. 30 ns maximum Minimum preset pulse width ............................................... 30 ns maximum Serial input setup time ........................................................ 30 ns minimum Serial input hold time .......................................................... 0 ns minimum
Device type 03
Minimum clock pulse width ................................................. 30 ns maximum
Minimum clear pulse width ................................................. 50 ns maximum Serial setup time ................................................................ 15 ns minimum Serial hold time .................................................................. 10 ns maximum
1/ Must withstand the added PD due to short circuit condition (e.g. IOS) at one output for 5 seconds duration.
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
2
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