MIL-M-38510-108 Microcircuits, Linear, Transistor Arrays, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon transistor arrays. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3

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MIL-M-38510/108A

4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply:

a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.

b. Burn-in test (method 1015 of MIL-STD-883) 1/.

Test condition	B		A 2/
Product assurance class	S	B	S	B
TA minimum	125°C	125°C	250°C	200°C
t minimum	240 hours	168 hours	16 hours or 200°C 168 hours	16 hours

Notes:

1/ The vertical columns of this table establish alternate combinations of test conditions from which the manufacturer may choose any one for a given product assurance class, at their option, unless otherwise specified in the procurement documentation. The same condition shall be used for all devices in a given inspection lot and the same condition shall be used for both burn-in (when applicable), and operating life test for any given inspection lot. Alternate 2 for stabilization bake and high temperature storage tests shall be used only when test condition A has been selected, and alternate 1 shall be used when test condition B has been selected.

2/ When accelerated test condition A is used, the centrifuge test and hermeticity tests of

method 5004 of MIL-STD-883 shall be performed, in that order, subsequent to the burn-in test and

before the final electrical test of method 5004 of MIL-STD-883.

c. Reverse bias burn-in (method 1015 of MIL-STD-883). This screen shall apply to class S only.

Test condition	A
Product assurance class	S
TA minimum	150°C
t minimum	72 hours

d. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer.

e. Additional screening for space level product shall be as specified in MIL-PRF-38535.

4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.

4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with

MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).

4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:

a. Tests shall be as specified in table II herein. b. Subgroup 8 shall be omitted.

4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.