4. VERIFICATION
MIL-M-38510/502A
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535. Qualification data for subgroups 7, 8, 9, 10, and 11 shall be attributes only.
4.3 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted prior to qualification, and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.
d. All devices processed by the manufacturer to an altered item drawing shall be programmed prior to burn in.
4.4 Technology Conformance Inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a. Tests shall be as specified in table II.
b. Subgroups 4, 5, and 6 of table III of MIL-PRF-38535 shall be omitted.
c. For unprogrammed devices, a sample shall be selected to satisfy programmability requirements prior to performing subgroups 9, 10, and 11. Twelve (12) devices shall be submitted to programming (see 3.3.2.1). If more than two devices fail to program, the lot shall be rejected. At the manufacturers option, the sample may be increased to 24 total devices with no more than 4 total device failures allowable.
d. For unprogrammed devices, ten devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and 11. If more than two total devices fail in all three subgroups, the lot shall be rejected. At the manufacturers option, the sample may be increased to 20 total devices with no more than four total device failures allowable.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
a. Water drop test. This test shall be added to group B for class S devices. The devices selected for subgroup 2 (b) testing shall be a sealed, electrically good unprogrammed device which has passed the applicable screening and group A electrical test requirements. The device shall be carefully delidded and functionally verified to contain no programmed bits. Power shall be applied (or continually cycled through its test sequence), for the duration of the test. A drop of deionized water (resistivity of 5 megohms minimum at the point of use and at 25°C) shall be placed on the memory element containing nichrome film resistors so as to completely cover a minimum of 25 percent of the memory bits without touching any bonding pads, wires, or exposed metallization. Examination the water drop at 20 X magnification during placement with a micropipette is sufficient to determine coverage. The water drop shall be allowed to remain with the device under power for a minimum of 3 minutes duration. The power shall be removed, the device dried, and the device functionally verified to contain no programmed bit. Failure of any functional test which results from an open thin nichrome resistor (other than test equipment induced)
shall fail the lot.
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