MIL-M-38510-654 Microcircuits, Digital, High Speed, Cmos Latches, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, high speed CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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MIL-M-38510/654A

4.5  Methods of inspection.  Methods of inspection shall be specified and as follows:

4.5.1  Voltage and current.  Unless otherwise specified, all voltages given are referenced to the microcircuit GND

terminal.  Currents given are conventional current and positive when flowing into the referenced terminal.

4.5.2  Burn-in and life test cool down procedures.  When the burn-in and life tests are completed and prior to removal of bias voltages, the devices under test (DUT) shall be cooled to within 10°C of their power stable condition at room temperature; then, electrical parameter end-point measurements shall be performed.

TABLE IV.  Delta limits at 25°C.

1/  The above parameters shall be recorded before and after the required burn-in and life tests to determine deltas (�).

4.5.3   Quiescent supply current (ICC  test).  When performing quiescent supply current measurements (ICC), the meter shall be placed so that all currents flow through the meter.

5.  PACKAGING

5.1  Packaging.  For acquisition purposes, the packaging requirements are as specified in the contract or order

(see 6.2).  When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements.  Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within the military service's system commands.  Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.

6.  NOTES

(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)

6.1  Intended use.  Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.

6.2  Acquisition requirements.  Acquisition documents should specify the following:

a.    Title, number, and date of the specification.

b.    PIN and compliance identifier, if applicable (see 1.2).

c.        Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable.

d.    Requirements for certificate of compliance, if applicable.

e.        Requirements for notification of change of product or process to contracting activity in addition to notification to the qualifying activity, if applicable.

f.        Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883), corrective action, and reporting of results, if applicable.

g.    Requirements for product assurance options.

h.        Requirements for special carriers, lead lengths, or lead forming, if applicable.  These requirements should not affect the part number.  Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the Government.

i.     Requirements for "JAN" marking.

j.     Packaging requirements (see 5.1).

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