MIL-M-38510-653 Microcircuits, Digital, High Speed, Cmos Flip-Flops, Monolithic Silicon, Positive LogicThis specification covers the detail requirements for monolithic silicon, high speed CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part or identifying number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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MIL-M-38510/653B

6.5  Abbreviations, symbols, and definitions.  The abbreviations, symbols, and definitions used herein are defined in

MIL-PRF-38535, MIL-HDBK-1331, and as follows:

TC  ................................................  Case temperature. CIN................................................  Input terminal-to-GND capacitance. GND ............................................  Ground zero voltage potential.

ICC  ...............................................  Quiescent supply current. TA  ................................................  Free air temperature.

VCC  ..............................................  Positive supply voltage. CPD...............................................  Power dissipation capacitance.

6.6  Logistic support.  Lead materials and finishes (see 3.4) are interchangeable.  Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class S for National Aeronautics and Space Administration or class B for Department of Defense (see 1.2.2), lead material and finish A (see 3.4).  Longer length leads and lead forming should not affect the part number.

6.7  Data reporting.  When specified in the purchase order or contract, a copy of the following data, as applicable, will be supplied.

a.        Attributes data for all screening tests (see 4.2) and variables data for all static burn-in, dynamic burn-in, and steady-state life tests (see 3.6).

b.    A copy of each radiograph.

c.    The technology conformance inspection (TCI) data (see 4.4).

d.    Parameter distribution data on parameters evaluated during burn-in (see 3.6). e.    Final electrical parameters data (see 4.2d).

6.8  Substitutability.  The cross-reference information below is presented for the convenience of users.  Microcircuits covered by this specification will functionally replace the listed generic-industry type.  Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation to case size.  The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.

6.9  Changes from previous.  Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extent of the changes.

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