MIL-M-38510/11?C
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Device types Package style
x |
See figure 1 |
4 |
01 |
Can |
y |
See figure 2 |
4 |
02 |
Flange mount |
x |
See figure 3 |
3 |
03 |
Can |
y |
See figure 4 |
2 |
04,05,06 |
Flange mount |
1.3 Absolute maximum ratings.
Input voltage (device types 01 and 02) ........................................................... 40 V Input-output differential voltage
(device types 03 and 04).............................................................................. 40 V (device types 05 and 06).............................................................................. 35 V
Lead temperature (soldering, 60 seconds) ..................................................... +300°C Junction temperature (TJ) ............................................................................... +150°C 1/
Storage temperature range ............................................................................ -65°C to +150°C
1.4 Recommended operating conditions. Input voltage range:
Device types 01 and 02 .............................................................................. 8 V dc to 38 V dc
Device types 03 and 04 .............................................................................. 4.25 V dc to 41.25 V dc
Device types 05 and 06 .............................................................................. 4.25 V dc to 36.25 V dc
Ambient operating temperature range (TA) .................................................... -55°C to +125°C
1.5 Power and thermal characteristics.
TA = TS |
Case |
Max eJA |
Maximum PD without heat sink |
Max eJC |
Maximum PD with heat sink |
Max eC-S 2/ |
125°C 3/ |
x |
140°C/W |
0.18 W |
40°C/W |
0.5 W |
10°C/W |
y |
35°C/W |
0.?1 W |
4°C/W 4/ |
5.6 W 5/ |
0.5°C/W |
|
25°C 3/ |
x |
140°C/W |
0.89 W |
40°C/W |
2.50 W |
10°C/W |
y |
35°C/W |
3.60 W |
4°C/W 4/ |
28.00 W 6/ |
0.5°C/W |
|
-55°C 3/ |
x |
140°C/W |
1.50 W |
40°C/W |
4.00 W |
10°C/W |
y |
35°C/W |
5.80 W |
4°C/W 4/ |
45.00 W 6/ |
0.5°C/W |
1/ The device is protected by a thermal shutdown circuit which is designed to turn off the output transistor whenever the device junction temperature is in excess of 150°C.
2/ This value represents the maximum allowable thermal impedance of a heat sink to remain within the thermal ratings.
3/ Based on TJ = 150°C and specified values of eJA and eJC.
4/ Maximum eJC at all temperatures (for case y only) = 1.5°C/W for device type 05 and 1.0°C/W for device type 06.
5/ Power dissipation (PD) at 125°C (for case y only) = 12.5 W for device type 05 and 16.6 W for device type 06.
6/ Power dissipation (PD) at -55°C and +25°C (for case y only) = 30 W for device type 05 and 50 W for device type 06.
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