MIL-M-38510/115B
4. VERIFICATION.
4.1 Sampling and inspection. Sampling and inspection procedures should be in accordance with MIL-PRF-38535 or as modified
in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply:
a. For class S and B devices, an additional burn-in screen shall be performed to test the operation of the thermal shutdown circuit. This screen shall be performed after serialization (3.1.8 of method 5004 of MIL-STD-883) and before interim electrical parameters (pre burn-in, 3.1.9 of method 5004 of MIL-STD-883). The requirements of
3.2.3 of method 1015 of MIL-STD-883 shall apply to this screen except the devices need not be tested in an oven.
b. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
c. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer.
d. Additional screening for space level product shall be as specified in MIL-PRF-38535.
e. Constant acceleration (method 2001 of MIL-STD-883); test condition B shall be used for case Y.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 8, 9, 10, and 11 shall be omitted in table II of method 5005 of MIL-STD-883 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535 and as follows:
a. End point electrical parameters shall be as specified in table II herein.
b. When using the method 5005 option, constant acceleration for class S (method 2001 of MIL-STD-883);
test condition B shall be used for case Y.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:
a. End point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
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