MIL-M-38510/1158
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 or as follows: Type X
Nickel ............................................................... 50-53 percent Manganese ...................................................... 0.60 percent, maximum Silicon .............................................................. 0.30 percent, maximum Carbon ............................................................. 0.10 percent, maximum Chromium ......................................................... 0.25 percent, maximum Cobalt ............................................................... 0.50 percent, maximum Phosphorous .................................................... 0.025 percent, maximum Sulfur ............................................................... 0.025 percent, maximum Aluminum ......................................................... 0.10 percent maximum Iron ............................................................... Remainder
3.4.1 Lead finish. The lead finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as specified in table I and apply over the full operating ambient temperature range of -55°C to +125°C.
3.5.1 Stability. If the device is located an appreciable distance from the power supply filter, a 2.0 μF solid tantalum bypass capacitor should be connected as close to the device VCC input as possible to suppress oscillation. A 2.0 μF solid tantalum bypass
capacitor is recommended on the device output. Output current oscillations are likely to occur in the current limit operating mode with
high input voltages (VIN < -18 V dc). Since load currents of less than 5 mA may result in a loss of voltage regulation, regulators should be preloaded with 5 mA of load current in lightly loaded applications.
3.5.2 Test limit. The test limits specified in tables I and III apply only for the stated test conditions (example, 2 percent duty cycle), which essentially keep the junction temperature constant. In most applications the junction temperature will greatly exceed the 25°C ambient or sink temperature; thus devices may not perform within the 25°C specified limits.
3.6 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 52 (see MIL-PRF-38535, appendix A).
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