MIL-M-38510-507 Microcircuits, Memory, Digital, CMOS Ultraviolet Erasable Programmable Array Logic, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, CMOS, erasable programmable array logic microcircuits which employ an EPROM cell as the programming element. Two product assurance classes B and S and a choice of case outlines and lead finishes are provided and are reflected in the complete part or identifying number PIN. For this product, the requirements of MIL-M-38510 have been

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INCH POUND

MIL-M-38510/507B

27 FEBRUARY 2006

SUPERSEDING MIL-M-38510/507A

26 MARCH 1992

MILITARY SPECIFICATION

MICROCIRCUITS, MEMORY, DIGITAL, CMOS ULTRAVIOLET ERASABLE PROGRAMMABLE ARRAY LOGIC, MONOLITHIC SILICON

Inactive for new design after 28 July 1995.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535.

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, CMOS, erasable programmable array logic microcircuits which employ an EPROM cell as the programming element. Two product assurance classes (B and S) and a choice of case outlines and lead finishes are provided and are reflected in the complete part or identifying number (PIN). For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.4).

1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device type. The device types are as follows:

Device type Circuit tPD

01	22 input, 10 output, AND-OR logic array	30 ns
02	22 input, 10 output, AND-OR logic array	25 ns
03	22 input, 10 output, AND-OR logic array	20 ns
04	22 input, 10 output, AND-OR logic array	15 ns

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outlines. The case outlines are designated in MIL-STD-1835 and as follows:

Outline letter K	Descriptive designator GDFP2-F24, CDFP3-F24	Terminals 24	Package style flat package
			(transparent lid to permit UV light erasure)
L	GDIP3-T24, CDIP4-T24	24	dual in line package
			(transparent lid to permit UV light erasure)
3	CQCC1-N28	28	square chip carrier package
			(transparent lid to permit UV light erasure)

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to memory@dscc.dla.mil . Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil .

AMSC N/A FSC 5962