MIL-M-38510-111 Microcircuits, Analog Switch With Driver, Monolithic And Multi-Chip SiliconThis specification covers the detail requirements for silicon, break-before-make, monolithic and multi-chip analog switches with drivers. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3

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MIL-M-38510/111A

4.4.4  Group D inspection.  Group D inspection shall be in accordance with table V of MIL-PRF-38535.  End point electrical parameters shall be as specified in table II herein.  A special subgroup shall be added to group D inspection for class S devices only, and it shall consist of the group A subgroups 4 and 7 as specified in table III herein.  This special subgroup shall be performed on each device type that is qualified from those listed in 1.2.1 herein.  After initial qualification, the special subgroup shall be performed periodically on a single device type selected from those device types previously qualified.  When more than one device type is qualified, the single device type selected shall be different device type for each subsequent periodic inspection until all qualified device types have been inspected.  The sequence of single device types shall be repeated to fulfill the periodic inspection requirement.

4.5  Methods of inspection.  Methods of inspection shall be specified and as follows.

4.5.1  Voltage and current.  All voltage values given, except differential voltages, are referenced to the external zero reference level of the supply voltage.  Currents given are conventional current and positive when flowing into the referenced terminal.

4.5.2  Life test cooldown procedure.  When devices are measured at 25°C following application of the operating life or burn-in test condition, they shall be cooled to room temperature prior to removal of the bias.

Table IV.  Groups C end point electrical parameters (TA = 25°C, ±VCC  = ±15 V).

5.  PACKAGING

5.1  Packaging requirements.  For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2).  When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements.  Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's System Command.  Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.

6.  NOTES

6.1  Intended use.  Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.

6.2  Acquisition requirements.  Acquisition documents should specify the following:

a.    Title, number, and date of the specification. b.    Complete part number (see 1.2).

c.        Requirements for delivery of one copy of the quality conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable.

d.    Requirements for certificate of compliance, if applicable.

e.        Requirements for notification of change of product or process to acquiring activity in addition to notification of the qualifying activity, if applicable.

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