MIL-M-38510/111A
c. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer.
d. Additional screening for space level product shall be as specified in MIL-PRF-38535.
e. Internal visual inspection (method 2010 and method 2017 multichip criteria of MIL-STD-883). For multichip devices, internal visual inspection shall be performed for each chip within the package.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, and 8 shall be omitted.
c. Subgroup 12 (device types 05, 06, 07, and 08) shall be added to group A inspection as specified in table III
herein. The sample size series number shall be 7 for all classes (accept on 0).
d. Subgroups 4 and 7 shall be performed for initial qualification only using a sample of 5 devices for each device type submitted to group A inspection, with no failure allowed. If not more than 1 failure is found in the first sample of 5, a second sample of 5 is permitted with no further failures allowed.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:
a. End point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.
c. A special subgroup shall be added to group C inspection for class B devices only, and it shall consist of the group A subgroups 4 and 7 as specified in table III herein. This special subgroup shall be performed on each device type that is qualified from those listed in 1.2.1 herein. After initial qualification, the special subgroup shall be performed periodically on a single device type selected from those device types previously qualified. A sample of 5 devices (of the device type to be inspected) shall be chosen and submitted to test with no failures allowed. If not more than 1 failure is found in the first sample of 5, a second sample of 5 is permitted with no further failures allowed. When more than one device type is qualified, the single device type selected shall be different device type for each subsequent periodic
inspection until all qualified device types have been inspected. The sequence of single device types shall be repeated to fulfill the periodic inspection requirement.
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