MIL-M-38510-111 Microcircuits, Analog Switch With Driver, Monolithic And Multi-Chip SiliconThis specification covers the detail requirements for silicon, break-before-make, monolithic and multi-chip analog switches with drivers. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3

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MIL-M-38510/111A

TABLE II. Electrical test requirements.

MIL-PRF-38535 test requirements	Subgroups (see table III)
MIL-PRF-38535 test requirements	Class S devices	Class B devices
Interim electrical parameters	1	1
Final electrical test parameters	1*, 2, 3, 9	1*, 2, 3, 9
Group A test requirements	1,2,3,(4,7), 9,10,11, (12)*	1,2,3,(4,7), 9,10,11, (12)*
Group B electrical test parameters when using the method 5005 QCI option	1,2,3 and table IV delta limits	N/A
Group C end-point electrical parameters	1,2,3 and table IV delta limits	1 and table IV delta limits
Additional electrical subgroups for group C periodic inspections	N/A	(4, 7)****
Group D end-point electrical parameters	1,2,3	1
Additional electrical subgroups for group D periodic inspections	(4,7)*****	None

* PDA applies to subgroup 1.

** See 4.4.1d

*** See 4.4.1c

**** See 4.4.3c

***** See 4.4.4

4. VERIFICATION.

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply:

a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.

b. Reverse bias burn-in (method 1015 of MIL-STD-883). This screen shall apply to class S only. However, regardless of device class, for device types 05, 06, 07, and 08, an additional burn-in will be performed following an interim electrical test (see table II, PDA applies). The additional burn-in will be performed with the logic level of the switch drivers opposite to that used in the first burn-in.