MIL-M-38510-140 Microcircuits, Linear, Monolithic And Hybrid Silicon, Microprocessor Compatible, 12 Bit Analog-To-Digital ConvertersThis specification covers the detail requirements for monolithic and hybrid, microprocessor compatible, 12-bit successive approximation analog-to-digital converters buffered outputs. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3.

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MIL-M-38510/140A

4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.

4.3.1 Qualification extension. For qualification inspection, if a manufacturer qualifies to device type 01 (monolithic) or device type 03 (hybrid), which is designed and manufactured identically (same die or dice, same process, same screening) in all respects (except electrical testing) to device type 02 (monolithic) or device type 04 (hybrid) respectively, then qualification may be extended to device type 02 or 04 respectively when authorized by the qualifying activity. Additionally, qualification may be extended to device type 02 or 04 respectively only after acceptance by the qualifying activity of subgroup C1 testing performed on the AT device types (see 6.6) and submission of data in accordance with MIL-PRF-38535.

4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with

MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).

4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:

a. Tests shall be as specified in table II herein. b. Subgroups 10 and 11 shall be omitted.

c. Subgroup 8 (LE (All codes test) 555°C ; TA ; +125°C, class B only ) shall be performed only for initial qualification and after process or design changes which may affect the Integral Linearity error.

The sample size series number for subgroup 8 shall be 5.

4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535 and as follows:

a. End point electrical parameters shall be as specified in table II herein. Delta limits shall apply only to group C inspection for class B devices.

4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:

a. End point electrical parameters shall be as specified in table II herein.

b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-STD-883.

4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical parameters shall be as specified in table II herein.

4.5 Methods of inspection. Methods of inspection shall be as specified and as follows.

4.5.1 Voltage and current. All voltage values given are referenced to the microcircuit ground terminal. Currents given are conventional and positive when flowing into the referenced terminal.

4.5.2 Life test and burn-in cooldown procedure. When devices are measured at +25°C following application of steady state life or burn-in test condition, they shall be cooled within +10°C of their power stable condition at room temperature prior to removal of the bias.