MIL-M-38510/110C
1.5 Power and thermal characteristics.
Case outlines |
Maximum allowable power dissipation |
Maximum εJC |
Maximum εJA |
A, D |
350 mW at TA = +125°C |
60°C/W |
140°C/W |
C |
400 mW at TA = +125°C |
35°C/W |
120°C/W |
z |
350 mW at TA = +125°C |
25°C/W |
176°C/W still air |
116°C/W 500 LFPM |
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein the text of this document shall takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
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