INCH-POUND MIL-M-38510/657A
19 May 2006
SUPERSEDING MIL-M-38510/657
30 September 1986
MILITARY SPECIFICATION
MICROCIRCUITS, DIGITAL, HIGH-SPEED CMOS, BUFFER GATES, MONOLITHIC SILICON
Reactivated after 19 May 2006 and may be used for new and existing designs and acquisitions.
This specification is approved for use by all Departments and Agencies of the Department of Defense.
The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535.
1. SCOPE
1.1 Scope. This specification covers the detail requirements for monolithic silicon, high speed CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).
1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.
1.2.1 Device types. The device types are as follows: Device type Circuit
01/51 Hex inverter
02/52 Hex inverter Schmitt trigger
03/53 Inverting octal three-state buffer
04/54 Octal three-state buffer
05/55 Octal three-state buffer
06 Hex bus driver, gated enable inputs for X-Y coincident bus control with three-state outputs
07 Hex inverter bus driver, gated enable inputs for X-Y coincident bus control with three-state outputs
08 Hex bus driver, 4-line and 2-line enable inputs with three-state outputs
09 Hex inverter bus driver, 4-line and 2-line enable inputs with three-state outputs
10/60 Octal inverter bus driver with three-state outputs
11/61 Octal non-inverting bus driver with three-state outptus
1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style
C |
GDIP1-T14 or CDIP2-T14 |
14 |
Dual-in-line |
E |
GDIP1-T16 or CDIP2-T16 |
16 |
Dual-in-line |
D |
GDFP1-F14 or CDFP2-F14 |
14 |
Flat pack |
F |
GDFP2-F16 or CDFP3-F16 |
16 |
Flat pack |
R |
GDIP1-T20 or CDIP2-T20 |
20 |
Dual-in-line |
S |
GDFP2-F20 or CDFP3-F20 |
20 |
Flat pack |
X |
See figure 4 |
20 |
Flat pack |
2 |
CQCC1-N20 |
20 |
Square leadless chip carrier |
Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or email to CMOS@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil.
AMSC N/A FSC 5962
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