MIL-M-38510/135G
NOTES:
1. Same configuration used for both amplifiers of device 04.
2. Low thermal EMF sockets are recommended. The number of solder joints and dissimilar metal junctions are to be minimized. The test circuit should contain a minimum number of components. All components should have the lowest possible temperature coefficients.
3. The temperature of the test circuit should be equal to that of the OUT.
4. Resistors 16 kn ±10.0%, 32 n ±10%, and 16 kn ±10.0% shall be used together or resistors
50 kn ±1.0%, 100 n ±1%, and 50 kn ±1.0% shall be used together.
FIGURE 4. Voltage offset test circuit.
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