MIL-M-38510-135 Microcircuits, Linear, Low Offset Operational Amplifiers, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, low offset operational amplifiers. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.4.

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MIL-M-38510/135G

TABLE II. Electrical test requirements.

MIL-PRF-38535 test requirements

Subgroups (see table III)

Class S

devices

Class B

devices

Interim electrical parameters

Final electrical test parameters 1/

1, 2, 3, 4, 7

Group A test requirements 2/

1, 2, 3, 4, 5,

6, 7, 9

1, 2, 3, 4, 5,

6, 7, 9

Group B electrical test parameters when using the method 5005 QCI option

1, 2, 3 and table IV

delta limits

N/A

Group C end-point electrical 3/

parameters

1, 2, 3 and table IV

delta limits

1 and table IV

delta limits

Group D end-point electrical 3/

parameters

1, 2, 3 and

table IV

end-point limits

1 and table IV

end-point limits

1/ Percent defective allowable (PDA) applies to subgroup 1.

2/ Subgroup 9 shall have a sample size series number of 5 for class S and class B devices.

3/ Table IV end-point parameters shall be used for VIO and IIB for class S and class B devices.

4. VERIFICATION

4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.

4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to qualification and quality conformance inspection. The following additional criteria shall apply:

a. The burn-in test duration, test condition, and test temperature, or approved alternatives, shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.

b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer.

c. Additional screening for space level product shall be as specified in MIL-PRF-38535.