MIL-M-38510/650C
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535. For product built in accordance with A.3.2.2
of MIL-PRF-38535, or as modified in the manufacturer's QM plan, the "QD" certification mark shall be used in place of the "Q" or "QML" certification mark.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 36 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.
b. Delete the sequence specified as interim (pre-burn-in) electrical parameters through interim (post-burn-in)
electrical parameters of table IA of MIL-PRF-38535 and substitute lines 1 through 7 of table II herein.
c. Burn-in (method 1015 of MIL-STD-883).
(1) Unless otherwise specified in the manufacturers QM plan for static tests (test condition A), ambient temperature (TA) shall be +125°C minimum. Test duration for each static test shall be
24 hours minimum for class S devices and in accordance with table I of method 1015 for class
B devices.
i. For static burn-in I, all inputs shall be connected to GND. Outputs shall be open or connected to VCC/2. Resistors are optional on outputs if open. Resistors are required on inputs and outputs connected to VCC/2. R = 470n to 47 kn.
ii. For static burn-in II, all inputs shall be connected through a resistor to VCC. Output shall be open or connected to VCC/2. Resistors are optional on outputs if open. Resistors are required on inputs and on outputs connected to VCC/2. R = 470n to 47 kn.
iii. VCC = 6.0 V ±0.5 V.
(2) Unless otherwise specified in the manufacturers QM plan for dynamic test (test condition D), ambient temperature shall be +125°C minimum. Test duration shall be in accordance with table I of method 1015.
i. For dynamic burn-in, all inputs shall be connected through the resistors in parallel to a common CP. Outputs shall connected to VCC/2 ±0.5 V through the resistors.
R = 1 kn ±0.5% for outputs, 470n to 47 kn for inputs.
ii. CP = 25 kHz to 1 MHz square wave; duty cycle = 50 %±15%; VIH = 4.5 V to VCC; VIL = 0.0 V ±0.5 V; transition time ≤ 0.5 µs.
iii. VCC = 6.0 V ±0.5 V.
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