MIL-M-38510/176B
TABLE V. Radiation hardened end-point electrical parameters at 25°C.
Parameter |
All device types |
VDD |
VTN VTP VT ISS tPLH tPHL |
0.3 V min 2.8 V max 1.4 V 100 x max limit 1.35 x max limit 1.35 x max limit |
10 V 10 V 10 V 18 V 5 V 5 V |
TABLE VI. Bias during exposure to radiation.
Device type |
Pin connections 1/ |
||
VDD = 10 V dc (through a 30 kν to 60 kν resistor) |
VSS = GND |
VDD = 10 V dc |
|
01 |
2, 3, 4, 5, 6, 7 |
8 |
16 |
02 |
1, 2, 4, 6, 8, 10, 13, 14, 16, 18, 20, 22 |
3, 12, 15 |
24 |
1/ Pins not designated are open, or may be tied to 10 V dc through a 30 to 60 kν resistor.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see
6.2). When actual packaging of material is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or
within the military service's system commands. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
6.1 Intended use. Microcircuits conforming to this specification are intended for original equipment design applications and logistic support of existing equipment.
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