MIL-M-38510-176 Microcircuits, Digital, Cmos, Latches, Monolithic Silicon, Positive LogicThis specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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INCH-POUND MIL-M-38510/1768

21 July 2004

MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, CMOS, LATCHES, MONOLITHIC SILICON, POSITIVE LOGIC

SUPERSEDING MIL-M-38510/176A

30 April 1984

Reactivated after 21 July, 2004 and may be used for new and existing designs and acquisitions.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits.

Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA)

are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of

MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).

1.2 Part or identifying number (PIN). The PIN is in accordance with MIL-PRF-38535 and as specified herein.

1.2.1 Device types. The device types are as follows: Device type Circuit

01 8-bit addressable latch

02 Dual 4-bit latch

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style

E		GDIP1-T16 or CDIP2-T16	16	Dual-in-line
F		GDFP2-F16 or CDFP3-F16	16	Flat pack
J		CDIP2-T24	24	Dual-in-line
K		GDFP2-F24 or CDFP3-F24	24	Flat pack
N		CDFP4-T16	16	Flat pack
T 1/	2/	GDFP7-F24 or CDFP8-F24	24	Flat pack, except A dimension
				equals 0.100" (2.54 mm) max
U 1/	2/	GDFP2-F16 or CDFP3-F16	16	Flat pack, except A dimension
				equals 0.100" (2.54 mm) max
z		GDFP7-F24 or CDFP8-F24	24	Flat pack

1/ As an exception to nickel plate or undercoating paragraphs of MIL-PRF-38535, appendix A, for case outlines T and U only, the leads of bottom brazed ceramic packages (i.e., configuration 2 of case outlinesz or F) may have electroless nickel undercoating which is 50 to 200 microinches (1.27 to 5.08 μm) thick provided the lead

finish is hot solder dip (i.e., finish letter A) and provided that, after any lead forming, an additional hot solder dip

coating is applied which extends from the outer tip of the lead to no more than 0.015 inch (0.38 mm) from the edge.

2/ For bottom or side brazed packages, case outlines T and U only, the S1 dimension may go to .000 inch

(.00 mm) minimum.

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, P.O. 8ox 3990, Columbus, Ohio 43218-3990, or email CMOS@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at www.dodssp.daps.mil.

AMSC N/A FSC 5962