MIL-M-38510/658A
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883.
b. Delete the sequence specified as interim (pre-burn-in) electrical parameters through interim (post-burn-in)
electrical parameters of method 5004 and substitute lines 1 through 7 of table II herein.
c. Burn-in (method 1015 of MIL-STD-883).
(1) Unless otherwise specified in the manufacturers QM plan for static tests (test condition A), ambient temperature (TA) shall be +125°C minimum. Test duration for each static test shall be
24 hours minimum for class S devices and in accordance with table I of method 1015 for class
B devices.
i. For static burn-in I, all inputs shall be connected to GND. Outputs shall be open or connected to VCC/2. Resistors are optional on outputs if open. Resistors are required on inputs and required on outputs and required on outputs connected to VCC/2. R = 680n to
47 kn.
ii. For static burn-in II, all inputs shall be connected through the resistors to VCC. Outputs shall be open or connected to VCC/2. Resistors are optional on outputs if open.
Resistors are required on inputs and required on outputs connected to VCC/2. R = 680n
to 47 kn.
iii. VCC/2 = VCC/2 ±0.5 V.
iv. VCC = 6.0 V ±0.5 V for device types 01-04.
VCC = 5.5 V ±0.5 V for device types 52 and 53.
(2) Unless otherwise specified in the manufacturers QM plan for dynamic test (test condition D), ambient temperature shall be +125°C minimum. Test duration shall be in accordance with table I of method 1015 of MIL-STD-883.
i. For dynamic burn-in, all select inputs shall be connected through the resistors R1 in parallel to the clock pulses as shown in paragraph v below. All outputs shall be connected through the resistors R2 to VCC/2. Output resistors = 1 kn ±5%.
ii. VCC = 6.0 V ±0.5 V for device types 01-04; VCC = 5.5 V ±0.5V for device types 52 and 53. iii. VCC/2 = VCC/2 ±0.5 V.
iv. Duty cycle = 50 percent ±15percent; VIH = 4.5 V minimum to VCC maximum; VIL = 0.0 V
±0.5V; tTLH and tTHL ≤ 500 ns.
v. For device type 01, input A, CP1 = 100 kHz square wave; input B, CP2 = 50 kHz square wave; input C, CP3 = 25 kHz square wave; input D, CP4 = 12.5 kHz square wave.
For device types 02 and 52, inputs A, B, and C, CP1, CP2, and CP3 = 25 kHz to 1 MHz square wave; CP3 = CP2/2, CP2 = CP1/2. Enable inputs G2A and G2B are connected to GND and G1 is connected through the resistor R2 to VCC/2.
For device types 03 and 53, input A, CP1 = 25 kHz to 1 MHz square wave; input B, CP2 = CP1/2. Enable input G is connected to GND.
For device type 04, inputs A, B, C, D, CP1, CP2, CP3, CP4 = 25 kHz to 1 MHz square wave; CP2 = CP1/2, CP3 = CP2/2, CP4 = CP3/2. Enable inputs G1 and G2 are connected through the resistors R1 to GND.
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