MIL-M-38510-58 Microcircuits, Digital, Cmos, Switches, Monolithic Silicon, Positive LogicThis specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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MIL-M-38510/58D

2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

3. REQUIREMENTS

3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4).

3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein.

3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein. Although eutectic die bonding is preferred, epoxy die bonding may be performed. However, the resin used shall be Dupont 5504 Conductive Silver Paste, or equivalent, which is cured at

200°C ±10°C for a minimum of 2 hours. The use of equivalent epoxies or cure cycles shall be approved by the qualifying activity. Equivalency shall be demonstrated in data submitted to the qualifying activity for verification.

3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.3.2 Truth table. The truth table shall be as specified on figure 2.

3.3.3 Switching time test circuit and waveforms. The switching time test circuit and waveforms shall be as specified on figures 3 and 4.

3.3.4 ON resistance test. The ON resistance test shall be as specified on figures 5, 6, and 7.

3.3.5 Switch leakage current. The switch leakage current shall be specified on figure 8.

3.3.6 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity or preparing activity upon request.

3.3.7 Case outlines. The case outlines shall be as specified in 1.2.3.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3.5 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics are as specified in table I, and apply over the full recommended case operating temperature range.

3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III.

3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.

3.7.1 Radiation hardness assurance identifier. The radiation hardness assurance identifier shall be in accordance with MIL-PRF-38535 and 4.5.4 herein.

3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 39 (see MIL-PRF-38535, appendix A).