MIL-M-38510-58 Microcircuits, Digital, Cmos, Switches, Monolithic Silicon, Positive LogicThis specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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INCH-POUND MIL-M-38510/58D

10 December 2004

MILITARY SPECIFICATION MICROCIRCUITS, DIGITAL, CMOS, SWITCHES, MONOLITHIC SILICON, POSITIVE LOGIC

SUPERSEDING MIL-M-38510/58C

1 October 1986

Reactivated after 10 Dec. 2004 and may be used for new and existing designs and acquisitions.

This specification is approved for use by all Departments and  Agencies  of the  Department of  Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535

1.  SCOPE

1.1  Scope.  This specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits.

Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA) are provided and are reflected in the complete Part or Identifying Number (PIN). For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 (see 6.3).

1.2  Part or identifying number (PIN).  The PIN is in accordance with MIL-PRF-38535 and as specified herein.

1.2.1  Device types.  The device types are as follows: Device type                                            Circuit

01                                       Quad bilateral switch

02                                       Quad bilateral switch

51                                       Quad bilateral switch

52                                       Quad bilateral switch

1.2.2  Device class.  The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3  Case outlines.  The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter               Descriptive designator                    Terminals              Package style

1/    As an exception to the nickel plate or undercoating paragraph of MIL-PRF-38535, appendix A, for case outlines X and Y only, the leads of bottom brazed ceramic packages (i.e., configuration 2 of case outlines A or D) may have electroless nickel undercoating which is 50 to 200 microinches (1.27 to 5.08 µm) thick provided the lead finish is hot solder dip (i.e., finish letter A) and provided that, after any lead forming, an additional hot solder dip coating is applied which extends from the outer tip

of the lead to no more than 0.015 inch (0.38 mm) from the package edge.

2/    For bottom or side brazed packages, case outlines X and Y only, the S1  dimension may go to .000 inch

(.00 mm) minimum.

Comments, suggestions, or questions on this document should be addressed to:  Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or email CMOS@dscc.dla.mil.  Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil.

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