MIL-M-38510/190D
4.6 Data reporting. When specified in the acquisition document, a copy of the following data, as applicable, shall be applied:
a. Attributes data for all screening tests (see 4.2) and variables data for all static burn-in, dynamic burn-in, and operating life tests.
b. The technology conformance inspection data (see 4.4).
Table IV. Group C end-point electrical parameters. TA = 25°C
Device types |
||||||
Parameter |
01, 07 |
02 |
03, 08 |
04 |
05 |
06 |
RON |
50 n or 10% 1/ |
150 n or 10% |
50 n or 10% |
150 n or 10% |
150 n or 10% 1/ |
150 n or 10% 1/ |
ID(OFF) |
15 nA |
15 nA |
15 nA |
15 nA |
15 nA |
15 nA |
IS(OFF) |
15 nA |
15 nA |
15 nA |
15 nA |
15 nA |
15 nA |
1/ Whichever is greater.
2/ Each of the above parameters shall be recorded before and after the required burn-in or life tests to determine deltas (�).
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.)
6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing equipment.
6.2 Acquisition requirements. Acquisition documents should specify the following:
a. Title, number, and date of the specification.
b. PIN and compliance identifier, if applicable (see 1.2).
c. Requirements for delivery of one copy of the conformance inspection data pertinent to the device inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
d. Requirements for certificate of compliance, if applicable.
e. Requirements for notification of change of product or process to acquiring activity in addition to notification of the qualifying activity, if applicable.
f. Requirements for failure analysis (including required test condition of MIL-STD-883, method 5003), corrective action and reporting of results, if applicable.
g. Requirements for product assurance options.
h. Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not affect the part number. Unless otherwise specified, these requirements will not apply to direct purchase by
or direct shipment to the Government.
i. Requirements for "JAN" marking.
j. Packaging requirements (see 5.1).
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