MIL-M-38510-174 Microcircuits, Digital, CMOS, Inverter, NAND Buffer Driver, Strobed Hex Inverter/Buffer, Voltage Level Shifter, Monolithic Silicon, Positive LogicThis specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40

MIL-M-38510/174B

TABLE V. Radiation hardened end-point electrical parameters at 25°C.

Parameter

All device types

VDD

VTN

VTP

ISS tPLH tPHL

0.3 V min

2.8 V max

1.4 V

100 x max limit

1.35 x max limit

10 V

18 V

5 V

TABLE VI. Bias during exposure to radiation.

Device type	Pin connections 1/
Device type	VDD = 10 V dc through a 30 kν to 60 kν resistor	VSS = GND	VDD = 10 V dc
01	1, 3, 5, 8, 9, 11, 13	7	14
02	3, 4, 5, 9, 10, 11	7	14
03	1, 3, 4, 6, 10, 12, 13, 15	8	16
04	2, 3, 6, 7, 9, 10, 14, 15	8	1, 16

1/ Pins not designated are open, or tied to 10 V dc through a 30 kν to 60 kν resistor.

4.6 Data reporting. When specified in the purchase order or contract, a copy of the following data, as applicable, shall be supplied.

a. Attributes data for all screening tests (see 4.2) and variables data for all static burn-in, dynamic burn-in, and steady-state life tests (see 3.6).

b. A copy of each radiograph.

c. The technology conformance inspection (TCI) data (see 4.4).

d. Parameter distribution data on parameters evaluated during burn-in (see 3.6). e. Final electrical parameters data (see 4.2d).

f. RHA delta limits.

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements are as specified in the contract or order (see

6.2). When actual packaging of material is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements

are maintained by the Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the military service's system command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.