MIL-M-38510/1198
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. This slash sheet has been modified to allow the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the Qualifying Activity.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity and the preparing activity (DSCC-VA) upon request.
3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. For dual and quad packages, the idle devices shall be connected as grounded followers or in the case of devices maintained in servo test loops, the idle devices shall have their outputs forced to ground via the output control voltage.
3.5.1 Offset null circuits. The nulling inputs shall be capable of being nulled 1 mV beyond the specified offset voltage limits for -55°C ≤ TA ≤ +125°C using the circuit of figure 2.
3.5.2 Instability oscillations. The device shall be free of oscillations when operated in the test circuits of this specification.
3.6 Electrical test requirements. Electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table III.
3.8 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8.1 Certification/compliance mark. The certification mark for device classes Q and V shall be "QML" or "Q" as required in MIL-PRF-38535. For class Q product built in accordance with A.3.2.2 of MIL-PRF-38535 or the alternative approved by the Qualifying Activity, the "QD" certification mark shall be used in place of the "QML" or "Q" certification mark.
3.9 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 85 (see MIL-PRF-38535, appendix A).
3
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business