MIL-M-38510-325 Microcircuits, Digital, Bipolar, Low-Power, Schottky Ttl, Flip-Flops, Cascadable, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, bipolar, low-power Schottky TTL, flip-flops, bistable logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41

MIL-M-38510/325D

3.4  Lead material and finish.  The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3.5  Electrical performance characteristics.  The electrical performance characteristics are as specified in table I, and apply over the full recommended case operating temperature range, unless otherwise specified.

3.6  Electrical test requirements.  The electrical test requirements for each device class shall be the subgroups specified in table II.  The electrical tests for each subgroup are described in table III.

3.7  Marking.  Marking shall be in accordance with MIL-PRF-38535.

3.8  Microcircuit group assignment.  The devices covered by this specification shall be in microcircuit group number 10 (see MIL-PRF-38535, appendix A).

4.  VERIFICATION

4.1  Sampling and inspection.  Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan.  The modification in the QM plan shall not effect the form, fit, or function as described herein.

4.2  Screening.  Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to qualification and quality conformance inspection.  The following additional criteria shall apply:

a.  The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535.  The burn-in test circuit shall be maintained under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request.  The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.

b.  Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test prior to burn-in is optional at the discretion of the manufacturer.

c.  Additional screening for space level product shall be as specified in MIL-PRF-38535,  appendix B.

4.3  Qualification inspection.  Qualification inspection shall be in accordance with MIL-PRF-38535.

4.4  Technology Conformance inspection (TCI).  Technology conformance inspection shall be in accordance with MIL- PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).

4.4.1  Group A inspection.  Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:

a.  Tests shall be as specified in table II herein. b.  Subgroups 4, 5, and 6 shall be omitted.

4.4.2  Group B inspection.  Group B inspection shall be in accordance with table II MIL-PRF-38535.

4