MIL-M-38510/314C
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to 7.0 V dc
Input voltage range ................................................................................ -1.5 V dc at -18 mA to 5.5 V dc
Storage temperature range .................................................................... -65° to +150°C Maximum power dissipation per flip-flop, (PD) 1/
Device type 01 ................................................................................. 110 mW dc
Device type 02 .................................................................................. 149 mW dc
Device type 03 .................................................................................. 61 mW dc
Lead temperature (soldering, 10 seconds) ............................................. 300°C Thermal resistance, junction to case (eJC):
Cases A, B, C, D, E, F, and 2 ............................................................... (See MIL-STD-1835)
Junction temperature (TJ) 2/.................................................................... 175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) .............................................................................. 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V dc
Maximum low level input voltage (VIL) .................................................... 0.7 V dc
Case operating temperature range (TC) ................................................. -55° to +125°C Minimum pulse width .............................................................................. 40 ns
Input pulse rise/fall time, device type 02
Schmitt, B input ................................................................................ 1 V/s minimum
Logic, A input ................................................................................... 1 V/µs minimum
Clear-inactive-state setup time
Device type 02 ................................................................................. 15 ns minimum
External timing resistance, Rext
Device type 01, 03 ........................................................................... 5 kn minimum, 180 kn maximum
Device type 02 ................................................................................. 1.4 kn minimum, 70 kn maximum
External timing capacitance, Cext
Device type 01, 03 ........................................................................... No restriction
Device type 02 ................................................................................. 1,000 µF maximum
Output duty cycle, device type 02
RT = 2 kn ......................................................................................... 50% duty cycle maximum
TT = 70 kn ........................................................................................ 90 % duty cycle maximum
Wiring capacitance, Rext/Cext terminal
Device type 01, 03 (referenced to GND) .......................................... 50 pF maximum
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with MIL-PRF-38535.
2
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