MIL-M-38510/130C
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535, MIL-HDBK-1331, and as follows:.
VIC |
................................................. |
Input clamp voltage. |
IOFF |
................................................. |
Collector off-state current. |
IIL |
................................................. |
Low level input current (with VIN = 0.4) |
ICCH |
................................................. |
High level supply current. This is the supply current with the output high. |
ICCL |
................................................. |
Low level supply current. This is the supply current with the output low. |
VOL |
................................................. |
Low level output voltage. This at rated load for the TTL gates. |
IOH |
................................................. |
High level output current. |
VOH |
................................................. |
High level output voltage, TTL gate. |
IOS |
................................................. |
Short-circuit output current TTL gate. |
VOC |
................................................. |
Output clamp diode forward voltage |
IOC |
................................................. |
Output clamp current (one output on). |
tS |
................................................. |
Storage time. |
tPLH |
................................................. |
Propagation delay time (low to high level output transition). |
tPHL |
................................................. |
Propagation delay time (high to low level output transition). |
tTLH |
.......................................................................... |
Transition time (low to high level output transition). |
tTHL |
................................................. |
Transition time (high to low level output transition). |
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature ranges or reliability factors equivalent to MIL-M-
38510 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of
MIL-PRF-38535.
Military device type Generic-industry type
01 55325
02 55326
03 55327
6.8 Changes from previous issue. Asterisks are not used in this revision to identify changes with respect to the previous issue, due to the extensiveness of the changes.
Custodians: Preparing activity: Army - CR DLA - CC
Navy - EC
Air Force - 11
NASA - NA
DLA - CC
Review activities: Army - MI, SM
Navy - AS, CG, MC, SH, TD Air Force - 03, 19, 99
Project 5962-2039
NOTE: The activities listed above were interested in this document as of the date of this document. Since organizations and responsibilities can change, you should verify the currency of the information above using the ASSIST Online database at www.dodssp.daps.mil.
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