MIL-M-38510/130C
1.3 |
Absolute maximum ratings. Supply voltage (VCC1) ............................................................................................... |
7.0 V |
Supply voltage (VCC2) (device types 01, 03) ............................................................. Input voltage (VIN) .................................................................................................... Output collector voltage (VOCV) (device types 02, 03) ............................................... Output clamp voltage (VOC) (device type 02) ............................................................ Output collector current (IOC) .................................................................................... Duty cycle for each output transistor ........................................................................ |
25 V 5.5 V 25 V 25 V 750 mA 20% 1/ |
|
Continuous total dissipation at TA = 25°C ................................................................ |
1375 mW |
Storage temperature range ...................................................................................... -65°C to +150°C
Junction temperature (TJ)......................................................................................... 150°C Lead temperature 1/16 inch from case, 60 seconds ................................................ 300°C
1.4 Recommended operating conditions.
Supply voltage range ................................................................................................ 4.5 V to 5.5 V Ambient operating temeperature range (TA) ............................................................ -55°C to +125°C
1.5 Power and thermal characteristics.
Case outline Maximum allowable power dissipation 2/ Maximum εJC Maximum εJA
E |
275 mW @ TA = 125°C |
29°C/W |
91°C/W |
F |
110 mW @ TA = 125°C |
70°C/W |
220°C/W |
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
1/ Warning: These devices do not pass the requirement for the glassivation layer integrity test (MIL-STD-883, method 2021) as specified in MIL-PRF-38535, A3.5.5.4. Therefore the glassivation layer integrity test is waived. Operation of these devices above the 20% duty cycle rating for each output transistor may result in device reliability problems.
2/ All leads welded or soldered to PC board.
2
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