Compliment Buffer, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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MIL-M-38510/55G

TABLE V. Radiation hardened end-point electrical parameters at 25°C.

Parameter

All device types

VDD

Device types

01-05

51-55

VTN

VTP

�VT

ISS tPLH tPHL

0.3 V min

2.8 V max

1.4 V max

100 x max limit

1.35 x max limit

10 V

15 V

5 V

10 V

18 V

5 V

TABLE VI. Bias during exposure to radiation.

Device type	Pin connections 1/
Device type	VDD = 10 V dc (through a 30 kn to 60 kn resistor)	VSS = GND	VCC and VDD = 10 V dc
01, 51	3, 5, 7, 9, 11, 14	8	1, 16
02, 52	3, 5, 7, 9, 11, 14	8	1, 16
03, 53	3, 5, 7, 9, 11, 14	8	1
04, 54	3, 5, 7, 9, 11, 14	8	1
05, 55	3, 6, 10, 13	7	14

1/ Pins not designated are open, or tied to 10 V dc through a 30 kn to 60 kn resistor.

5. PACKAGING

5.1 Packaging. For acquisition purposes, the packaging requirements are as specified in the contract or order

(see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense Agency, or within the military service's system commands. Packaging data retrieval is available from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.