MIL-M-38510/3828
1.3 Absolute maximum ratings.
Supply voltage range .......................................................................... -0.5 V dc to +7.0 V dc
Input voltage range ............................................................................. -1.5 V dc at -18 mA to +7.0 V dc
Storage temperature range ................................................................. -65° to +150°C
Maximum power dissipation, per device (PD) 1/
Device types 01 and 02 ................................................................. 148.5 mW
Device types 03 and 04 ................................................................. 170.5 mW Lead temperature (soldering, 10 seconds) ........................................... +300°C
Thermal resistance, junction to case (εJC) ............................................ (See MIL-STD-1835) Junction temperature (TJ) 2/ ................................................................ 175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) ........................................................................... 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ................................................. 2.0 V dc
Maximum low level input voltage (VIL) ................................................. 0.8 V dc
Case operating temperature range (TC) ............................................... -55°C to +125°C Input set-up time, t(SETUP):
Device types 01, 02, 03, and 04 .................................................... 10 ns minimum
Input hold time, t(HOLD):
Device types 01 and 03 ................................................................. 7 ns minimum
Device types 02 and 04 ................................................................. 10 ns minimum
Input pulse width, (tP):
Device types 01 and 03 (Enable) ................................................... 10 ns minimum
Device types 02 and 04 (Enable) ................................................... 15 ns minimum Device type 03 (Clear) .................................................................. 15 ns minimum Device type 04 (Preset) ................................................................. 15 ns minimum
2. APPLICA8LE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
1/ Must withstand the added PD due to short-circuit test (e.g., IO).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
2
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