MIL-M-38510-382 Microcircuits, Digital, Bipolar, Advanced Low Power Schottky Ttl, D-Type Latches, Cascadable, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, advanced low power Schottky TTL, D-type latches, bistable logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3.

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INCH-POUND MIL-M-38510/382B

5 November 2004

SUPERSEDING MIL-M-38510/382A

16 August 1983

MILITARY SPECIFICATION

MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, D-TYPE LATCHES, CASCADABLE, MONOLITHIC SILICON

Inactive for new design after 8 July 1997.

This specification is approved for use by all Departments and Agencies of the Department of Defense.

The requirements for acquiring the product herein shall consist of this specification sheet and MIL-PRF 38535

1. SCOPE

1.1 Scope. This specification covers the detail requirements for monolithic silicon, advanced low power Schottky TTL, D-type latches, bistable logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, (see 6.3).

1.2 Part or Identifying Number (PIN). The PIN is in accordance with MIL-PRF-38535, and as specified herein.

1.2.1 Device types. The device types are as follows:

Device type Circuit

01 Octal D-type transparent latch with 3-state outputs, cascadable

02 Octal D-type transparent latch with inverted 3-state outputs, cascadable

03 Dual 4-bit D-type transparent latch with 3-state outputs, cascadable

04 Dual 4-bit D-type transparent latch with inverted 3-state outputs, cascadable

1.2.2 Device class. The device class is the product assurance level as defined in MIL-PRF-38535.

1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style

K	GDFP2-F24 or GDFP3-F24	24	Flat package
L	GDIP3-T24 or GDIP4-T24	24	Dual-in-line
R	GDIP1-T20 or CDIP2-T20	20	Dual-in-line
S	GDFP2-F20 or CDFP3-F20	20	Flat pack
2	CQCC1-N20	20	Square leadless chip carrier
3	CQCC1-N28	28	Square leadless chip carrier

Comments, suggestions, or questions on this document should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAS, P. O. Box 3990, Columbus, OH 43218-3990, or emailed to bipolar@dscc.dla.mil . Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https://assist.daps.dla.mil .

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