MIL-M-38510/3808
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................. -0.5 V dc to +7.0 V dc
Input voltage range ................................................................................. -1.5 V dc at -18 mA to +7.0 V dc
Storage temperature range .................................................................... -65° to +150°C Maximum power dissipation, per device (PD) 1/
Device types 01 and 02 .................................................................... 115 mW
Device type 03 .................................................................................. 137.5 mW Device type 04 .................................................................................. 198 mW
Device type 05 .................................................................................. 176 mW
Lead temperature (soldering, 10 seconds) ............................................. +300°C
Thermal resistance, junction to case (eJC) .............................................. (See MIL-STD-1835) Junction temperature (TJ) 2/ ................................................................... 175°C
1.4 Recommended operating conditions.
Maximum low level output current (IOL):
Device types 01, 02, and 03 ............................................................. 4.0 mA
Device types 04 and 05 .................................................................... 12.0 mA
Supply voltage (VCC) ............................................................................... 4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V dc Maximum low level input voltage (VIL) .................................................... 0.8 V dc Normalized fanout (each output) 3/ :
At low logic level ............................................................................... 10 maximum
At high logic level ............................................................................. 20 maximum
Input clock frequency (fMAX)
+25°C;
Device types 01 and 02 ............................................................... 40 MHz
Device types 03, 04, and 05 ........................................................ 30 MHz
-55°C/+125°C;
Device types 01 and 02 ............................................................... 35 MHz
Device types 03, 04, and 05 ........................................................ 25 MHz
Width of clock pulse (tP CLOCK)
+25°C;
Device types 01 and 02 ............................................................... 12.5 ns
Device types 03 ........................................................................... 15 ns
-55°C/+125°C;
Device types 01 and 02 ............................................................... 14 ns
Device types 03 ........................................................................... 20 ns
+25°C;
Device types 04 and 05 ............................................................... 16.5 ns
-55°C/+125°C;
Device types 04 and 05 ............................................................... 20 ns
Width of asynchronous clear pulse (tP ACLR):
Device types 01, 04, and 05 ............................................................. 20 ns
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ The device should fanout in both high and low levels to specified number of inputs of the same device type as that being tested.
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