MIL-M-38510-123 Microcircuits, Linear, Cmos, Negative Logic, Analog Switch, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, CMOS negative logic analog switches. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35

MIL-M-38510/123B

1.3 Absolute maximum ratings. 1/

Supply voltage between V+ and V-:

Device types 01, 02 ........................................................................................... +40 V

Digital input voltage ................................................................................................. (+Vsupply) VIN (-0.3 V)

Analog input voltage ................................................................................................ (+Vsupply +2 V) VA (-Vsupply -2 V) Storage temperature ................................................................................................ -65°C to +150°C

Lead temperature (soldering, 10 seconds) ............................................................... +300°C Junction temperature (TJ)......................................................................................... 175°C Maximum current:

Any terminal (except S or D) .............................................................................. 30 mA S or D terminals ................................................................................................. 20 mA

1.4 Recommended operating conditions.

Positive supply voltage ............................................................................................ +15 V dc Negative supply voltage ........................................................................................... - 15 V dc Reference voltage .................................................................................................... Open Input (address) high voltage ..................................................................................... 2.4 V

VIL ...................................................................................................................... 0.8 V

Ambient operating temeperature range (TA) ............................................................ -55°C to +125°C

1.5 Power and thermal characteristics.

Case outline Maximum allowable power dissipation 2/ Maximum εJC Maximum εJA

C, E	400 mW @ TA = 125°C	35°C/W	120°C/W
I	350 mW @ TA = 125°C	40°C/W	140°C/W

2. APPLICABLE DOCUMENTS

2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.

2.2 Government documents.

2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 - Test Method Standard for Microelectronics.

MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.

(Copies of these documents are available online at https://assist.daps.dla.mil;qu/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.

1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability.

2/ All leads welded or soldered to PC board.