MIL-M-38510/116A
1.3 Absolute maximum ratings.
VIN to ground ............................................................................................................ V+ + 18, V+ - 36 V dc
+VCC to -VCC ............................................................................................................ 44 V dc
+VCC to ground ........................................................................................................ +36 V dc
VS or VD .................................................................................................................... +VCC, -VCC
Current (any terminal) ............................................................................................. 30 mA
Pulsed 1 ms, 10% duty cycle (S or D only) ............................................................. 100 mA
Storage temperature ................................................................................................ -65°C to +150°C Lead temperature (soldering, 60 seconds) ............................................................... +300°C
Junction temperature ............................................................................................... TJ = +175°C
1.4 Recommended operating conditions.
+VCC ..................................................................................................................... +15 V dc
-VCC .................................................................................................................... - 15 V dc
GND ..................................................................................................................... 0 V dc
Ambient operating temeperature range (TA) ............................................................ -55°C ≤ TA ≤ +125°C
1.5 Power and thermal characteristics.
Case outline Maximum allowable power dissipation Maximum εJC Maximum εJA
C |
400 mW @ TA = 125°C |
35°C/W |
120°C/W |
D |
350 mW @ TA = 125°C |
60°C/W |
140°C/W |
I |
350 mW @ TA = 125°C |
40°C/W |
140°C/W |
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.
2.1.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at https://assist.daps.dla.mil;qu/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.
2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
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