MIL-M-38510/754B
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in this document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid adversely impacting existing government logistics systems and contractors parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information pertaining to qualification of products may be obtained from DSCC-VQ, P.O. Box 3990, Columbus, Ohio 43218-3990.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535, MIL-HDBK-1331, and as follows:
CIN ............................................... Input terminal-to-GND capacitance COUT............................................. Output terminal-to-GND capacitance GND ........................................... Ground zero voltage potential
ICCH .............................................. Quiescent supply current, outputs high
ICCL .............................................. Quiescent supply current, outputs low
ICCZ .............................................. Quiescent supply current, outputs three-state
IIL ................................................. Input current low
IIH................................................. Input current high
TC ............................................... Case temperature
TA ................................................ Ambient temperature
VCC .............................................. Positive supply voltage
CPD .............................................. Power dissipation capacitance
VIC ............................................... Input clamp voltage
VGB .............................................. Ground bounce voltage
O/V .............................................. Latch-up over-voltage
O/I ............................................... Latch-up over-current tw.................................................. Trigger duration (width)
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class S for National Aeronautics and Space Administration or class B for Department of Defense (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming
should not affect the part number.
6.7 Data reporting. When specified in the purchase order or contract, a copy of the following data, as applicable, will be supplied.
a. Attributes data for all screening tests (see 4.2) and variables data for all static burn-in, dynamic burn-in, RHA tests, and steady-state life tests (see 3.6).
b. A copy of each radiograph.
c. The technology conformance inspection (TCI) data (see 4.4).
d. Parameter distribution data on parameters evaluated during burn-in (see 3.6). e. Final electrical parameters data (see 4.2e).
f. RHA delta limits.
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