MIL-M-38510-754 Microcircuits, Digital, Advanced Cmos, Latches, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, advanced CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance RHA are provided and are reflected in the complete Part or Identifying Number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535 see 6.3.

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MIL-M-38510/7548

3.3.3 Voltage levels for ground bounce. The voltage levels for ground bounce shall be as specified on figure 3.

3.3.4 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.

3.3.5 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the qualifying activity or preparing activity upon request.

3.3.6 Case outlines. The case outlines shall be as specified in 1.2.3 herein.

3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).

3. 5 Electrical performance characteristics and post irradiation end-point electrical parameter limits. Unless otherwise specified, the electrical performance characteristics and postirradiation end-point electrical parameter limits are as specified in table I and apply over the case operating temperature range specified. Test conditions for these specified characteristics and limits are as specified in table I.

3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Radiation hardness assurance level M, D, P, L , and R (see MIL-PRF-38535) in table I are postirradiation end-point electrical parameters.

3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.

3.7.1 Radiation hardness assurance identifier. The radiation hardness assurance identifier shall be in accordance with

MIL-PRF-38535 and herein (see 3.6).

3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 38 (see

MIL-PRF-38535, appendix A).