MIL-M-38510/60B
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535, MIL-HDBK-1331, and as follows:
GND ............................................ Ground zero voltage potential
VOTH ............................................. High-level threshold output voltage VOTL ............................................. Low-level threshold output voltage VITH .............................................. High-level threshold input voltage VITL .............................................. Low-level threshold input voltage
VEEL ............................................. Shifted power supply voltage for the purpose of ac testing
TJ ................................................ Circuit junction temperature
TC ................................................ Case operating temperature
PD ................................................ Circuit power dissipation
eJA ................................................ Junction to ambient thermal resistance in °C per watt
eJC ................................................ Junction to case thermal resistance
6.6 Logistic support. Lead materials and finishes (see 3.4) are interchangeable. Unless otherwise specified, microcircuits acquired for Government logistic support will be acquired to device class B (see 1.2.2), lead material and finish A (see 3.4). Longer length leads and lead forming should not affect the part number.
6.7 Substitutability. The cross-reference information below is presented for the convenience of users. Microcircuits covered by this specification will functionally replace the listed generic-industry type. Generic-industry microcircuit types may not have equivalent operational performance characteristics across military temperature
ranges or reliability factors equivalent to MIL-M-35810 device types and may have slight physical variations in relation to case size. The presence of this information should not be deemed as permitting substitution of generic-industry types for MIL-M-38510 types or as a waiver of any of the provisions of MIL-PRF-38535.
Military device type |
Generic-industry type |
01 |
10501 |
02 |
10502 |
03 |
10505 |
04 |
10506 |
05 |
10507 |
06 |
10509 |
6.8 Environmental variations versus device testing and operation. Different nominal values of air velocity and temperature may be selected for device tests and in-system operation. However, when this occurs or when air velocity and temperature gradients cause a shift in device junction temperature greater than ± 2°C, the device output voltages and input forcing functions assume significant new values. Based on the typical thermal resistance curve
of figure 7, the new values can be determined from the procedures in 6.8.1.
6.8.1 Procedures for determining new values of device output voltage and input forcing function.
a. Determine device power dissipation by power supply drain current and the following equation: PD (max) = IEE(max) x VEE + 9.7 mW x number of outputs.
b. Using this maximum power dissipation, enter figures 4 and 5 as applicable for the case outline and determine the junction temperature deviation (�TJ) for the selected nominal air velocity.
c. If the actual ambient test or system temperatures are other than those specified (-55°C, 25°C, 125°C), the difference between the actual and specified values shall be algebraically added to the �TJ for the air velocity determined in (b) above to obtain a �TJ (total).
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