MIL-M-38510-505 Microcircuits, Digital, Bipolar Programmable Logic, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, bipolar, programmable logic microcircuits which employ titanium tungsten resistors as the fusible link or programming element. Two product assurance classes B and S and a choice of case outlines and lead finishes are provided and are reflected in the complete part or identifying number PIN. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.4.

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MIL-M-38510/505C

1.3  Absolute maximum ratings.

Supply voltage range ......................................................  -0.5 V dc to +12.0 V dc Input voltage range .........................................................  -1.5 V dc to +12.0 V dc Storage temperature range  ............................................  -65°C to +150°C

Lead temperature (soldering, 10 seconds) .....................    +260°C

Thermal resistance, junction-to-case  ( θ JC)   1/.............. (See MIL-STD-1835) Output voltage applied ....................................................  -1.5 V dc to +12.0 V dc Output sink current ..........................................................  100 mA

Maximum power dissipation (PD)   2/  .............................   1.2 W

Maximum junction temperature (TJ) ................................  +175°C

1.4  Recommended operating conditions.

Supply voltage ................................................................  4.5 V dc minimum to 5.5 V dc maximum

Minimum high level input voltage   ..................................  2.0 V dc

Maximum low level input voltage ....................................  0.8 V dc

Case operating temperature range (TC  ) .........................  -55°C to +125°C

2.  APPLICABLE DOCUMENTS

2.1  General.  The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples.  While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.

2.2  Government documents.

2.2.1  Specifications and standards.  The following specifications and standards form a part of this document to the extent specified herein.  Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATIONS

MIL-PRF-38535   -        Integrated Circuits (Microcircuits) Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883       -        Test Method Standard for Microelectronics.

MIL-STD-1835     -        Interface Standard Electronic Component Case Outlines

(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA  19111-

5094.)

2.3  Order of precedence.  In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence.  Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

1/  Heat sinking is recommended to reduce the junction temperature.

2/  Must withstand the added PD due to short circuit condition; e.g., IOS  test.

2