MIL-M-38510-350 Microcircuits, Digital, Bipolar, Advanced Schottky Ttl, Quad 2-Port Registers, Cascadable, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, advanced Schottky TTL, quad 2-port register microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided for each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3.

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MIL-M-38510/350A

1.3  Absolute maximum ratings.

Supply voltage range  .............................................................................  -0.5 V dc to +7.0 V dc

Input voltage range  ................................................................................  -1.2 V dc at -18 mA to +7.0 V dc

Storage temperature range  ....................................................................  -65° to +150°C Maximum power dissipation, per device (PD)  1/

Device type 01  .................................................................................  209 mW

Device type 02  .................................................................................  187 mW

Lead temperature (soldering, 10 seconds) .............................................  +300°C

Thermal resistance, junction to case (eJC) ..............................................  (See MIL-STD-1835) Junction temperature (TJ) 2/ ...................................................................  175°C

1.4  Recommended operating conditions.

Supply voltage (VCC)  ..............................................................................  4.5 V dc minimum to 5.5 V dc maximum

Minimum high level input voltage (VIH) ...................................................  2.0 V dc Maximum low level input voltage (VIL) ....................................................  0.8 V dc Normalized fanout (each output)  3/ :

Low level  ..........................................................................................  33 maximum

High level  .........................................................................................  50 maximum

Case operating temperature range (TC)  .................................................  -55° to +125°C Width of clock pulse high:

Device type 01, 02  ...........................................................................  4.0 ns minimum

Width of clock pulse low:

Device type 01, 02  ...........................................................................  7.0 ns minimum

Setup time in high to clock pulse:

Device type 01, 02  ...........................................................................  4.5 ns minimum

Setup time in low to clock pulse:

Device type 01, 02  ...........................................................................  4.5 ns minimum

Setup time S high to clock pulse:

Device type 01  .................................................................................  10.5 ns minimum

Device type 02  .................................................................................  9.5 ns minimum

Setup time S low to clock pulse:

Device type 01  .................................................................................  10.5 ns minimum

Device type 02  .................................................................................  9.5 ns minimum

Hold time in high to clock pulse:

Device type 01, 02  ...........................................................................  1.5 ns minimum

Hold time in low to clock pulse:

Device type 01, 02  ...........................................................................  1.5 ns minimum

Hold time S high to clock pulse:

Device type 01, 02  ...........................................................................  0 ns minimum

Hold time S low to clock pulse:

Device type 01, 02  ...........................................................................  0 ns minimum

2.  APPLICABLE DOCUMENTS

2.1  General.  The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples.  While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed.

1/  Must withstand the added PD  due to short-circuit test (e.g., IOS).

2/  Maximum junction temperature should not be exceeded except in accordance with allowable short

duration burn-in screening condition in accordance with MIL-PRF-38535.

3/  The device should fanout in both high and low levels to specified number of inputs of the same device type as that being tested.

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