MIL-M-38510-343 Microcircuits, Digital, Bipolar, Advanced Schottky Ttl, Binary Counters, Monolithic SiliconThis specification covers the detail requirements for monolithic silicon, advanced Schottky TTL, binary counter microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided or each type and are reflected in the complete part number. For this product, the requirements of MIL-M-38510 have been superseded by MIL-PRF-38535, see 6.3.

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MIL-M-38510/3438

1.3  Absolute maximum ratings.

Supply voltage range  .............................................................................  -0.5 V dc to +7.0 V dc

Input voltage range  ................................................................................  -1.2 V dc at -18 mA to +7.0 V dc

Storage temperature range  ....................................................................  -65° to +150°C Maximum power dissipation, per device (PD)  1/

Device types 01, 02, 03, 04 ..............................................................  303 mW

Lead temperature (soldering, 10 seconds) .............................................  +300°C

Thermal resistance, junction to case (eJC): .............................................  (See MIL-STD-1835) Junction temperature (TJ) 2/ ...................................................................  175°C

1.4  Recommended operating conditions.

Supply voltage (VCC)  ..............................................................................  4.5 V dc minimum to

5.5 V dc maximum

Minimum high level input voltage (VIH) ...................................................  2.0 V dc Maximum low level input voltage (VIL) ....................................................  0.8 V dc Normalized fanout (each output) 3/

Low logic level ..................................................................................  33 maximum

High logic level .................................................................................  50 maximum

Case operating temperature range (TC)  .................................................  -55° to +125°C Width of clock pulse, high (PE  = High)

Device types 01, 02 ..........................................................................  9.0 ns minimum

Width of clock pulse, high (PE  = Low)

Device types 01, 02 ..........................................................................  7.0 ns minimum

Width of clock pulse, low ( PE  = High)

Device types 01, 02 ..........................................................................  8.0 ns minimum

Width of clock pulse, low ( PE  = Low)

Device types 01, 02 ..........................................................................  9.0 ns minimum

Width of master reset pulse, low ( MR  = low)

Device type 01  .................................................................................  9.5 ns minimum

Width of  PL  pulse low:

Device type 03  .................................................................................  8.5 ns minimum

Device type 04  .................................................................................  7.5 ns minimum

Width of clock pulse low:

Device type 03  .................................................................................  7.0 ns minimum

Width of CPU or CPD pulse low

Device type 04  .................................................................................  7.0 ns minimum

Width of master reset pulse, high (MR  = high)

Device type 04  .................................................................................  6.0 ns minimum

Width of CPU or CPD pulse, low (change of direction)

Device type 04  .................................................................................  12.0 ns minimum

Setup time Pn high to clock pulse

Device types 01, 02 ..........................................................................  5.5 ns minimum

Setup time Pn low to clock pulse

Device types 01, 02 ..........................................................................  5.5 ns minimum

Setup time PE  or  SR  high to clock pulse

Device types 01, 02 ..........................................................................  13.5 ns minimum

Setup time PE  or  SR  low to clock pulse

Device types 01, 02 ..........................................................................  10.5 ns minimum

1/  Must withstand the added PD  due to short-circuit test (e.g., IOS).

2/  Maximum junction temperature shall not be exceeded except in accordance with allowable short

duration burn-in screening condition in accordance with MIL-PRF-38535.

3/  The device shall fanout in both high and low levels to the specified number of inputs of the same device type as that being tested.

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