MIL-M-38510/319C
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to 7.0 V dc Input voltage range ................................................................................ -1.5 V at -18 mA to 5.5 V Storage temperature range .................................................................... -65° to +150°C
Maximum power dissipation (PD) 1/
Device type 01 ................................................................................. 275 mW
Device type 02 ................................................................................. 220 mW
Lead temperature (soldering, 10 seconds) ............................................. 300°C Thermal resistance, junction to case (eJC):
Cases E, F, and 2 ................................................................................ (See MIL-STD-1835)
Junction temperature (TJ) 2/................................................................... +175°C
1.4 Recommended operating conditions.
Supply voltage (VCC) .............................................................................. 4.5 V minimum to 5.5 V maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V Maximum low level input voltage (VIL) .................................................... 0.7 V
Case operating temperature range (TC) ................................................. -55°C to +125°C Minimum width of write enable or read enable pulse ............................. 25 ns
Minimum setup time (data) ..................................................................... 10 ns
Minimum setup time (write select) .......................................................... 15 ns
Minimum hold time (data) ....................................................................... 15 ns (with respect to GW) Minimum hold time (write select) ............................................................ 5 ns
Minimum latch time for new data ............................................................ 25 ns
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to the extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for. STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard for Microelectronics.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
(Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with MIL-PRF-38535.
2
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